标准号 |
中文名称 |
英文名称 |
| NF C93-910-10-2001 |
光纤导线接口.第10部分:小型MPO型导线系列 |
(Fibre optic connector interfaces - Part 10 : type Mini-MPO connector family.) |
| NF C93-910-12-2000 |
光纤连接器接口.第12部分:FS 型连接器门类 |
(Fibre optic connector interfaces - Part 12 : type FS connector family.) |
| NF C93-910-13-2000 |
纤维光学连接器接口.第13部分:FC-PC型连接器门类 |
(Fibre optic conector interfaces - Part 13 : type FC-PC connector family.) |
| NF C93-910-15-2001 |
光纤连接器接口.第15部分:LSH型连接器系列 |
(Fibre optic connector interfaces - Part 15 : type LSH connector family.) |
| NF C93-910-16-2000 |
光纤连接器接口.第16部分:PN型连接器系列 |
(Fibre optic connector interfaces - Part 16 : type PN connector family.) |
| NF C93-910-19-2002 |
光纤连接器接口.第19部分:SG型连接器系列 |
(Fibre optic connector interfaces - Part 19 : type SG connector family.) |
| NF C93-910-2-1997 |
光纤连接器接口.第2部分:BFOC/2,5型连接器系列 |
(Fibre optic connector interfaces. Part 2 : type BFOC/2,5 connector family.) |
| NF C93-910-4-1997 |
纤维光学连接器接口.第4部分:SC型连接器系列 |
(Fibre optic connector interfaces. Part 4 : type SC connector family.) |
| NF C93-910-4/A1-2000 |
纤维光学连接器接口.第4部分:SC型连接器门类 |
(Fibre optic connector interfaces - Part 4 : type SC connector family.) |
| NF C93-910-4/A2-2001 |
光纤连接器接口.第4部分:SC型连接器系列 |
(Fibre optic connector interfaces - Part 4 : type SC connector family.) |
| NF C93-910-6-1998 |
纤维光学连接器接口.第6部分:MU型连接器系列 |
(Fibre optic connector interfaces. Part 6 : type MU connector family.) |
| NF C93-910-6/A1-2001 |
光纤导线接口.第6部分:MU型导线系列 |
(Fibre optic connector interfaces - Part 6 : type MU connector family.) |
| NF C93-910-8-1998 |
纤维光学连接器的接口.第6部分:MU型连接族 |
(Fibre optic connector interfaces. Part 8 : type CF08 connector family.) |
| NF C93-911-1-1997 |
光纤端件.第1部分:空白详细规范 |
(Fibre optic terminus sets. Part 1-1 : blank detail specification.) |
| NF C93-911-1997 |
光纤端件.第1部分:总规范 |
(Fibre optic terminus sets. Part 1 : generic specification.) |
| NF C93-912-1-1997 |
光纤适配器.第1-1部分:空白详细规范 |
(Fibre optic adaptors. Part 1-1 : blank detail specification.) |
| NF C93-912-1997 |
光纤适配器.第1部分:总规范 |
(Fibre optic adaptors. Part 1 : generic specification.) |
| NF C93-913-1-2001 |
光学通信用光纤互连装置和无源件的可靠性.第1部分:介绍指南和定义 |
(Reliability of fibre optic interconnecting devices and passive components for optical communications - Part 1 : introductory guide and definitions.) |
| NF C93-913-2-2001 |
纤维光学互连装置和无源件的可靠性.第2部分:基于加速老化试验的可靠性定量评价.温度、湿度和稳定状态 |
(Reliability of fibre optic interconnecting devices and passive components - Part 2 : quantitative assessment of reliability based on accelerated ageing tests - Temperature and humidity, steady state.) |
| NF C93-913-3-2001 |
光纤互连装置和无源件的可靠性.第3部分:评价无源件失败模块和方法的相应试验 |
(Reliability of fibre optic interconnecting devices and passive components - Part 3 : relevant tests for evaluating failure modes and failure mechanisms for passive components.) |
| NF C93-913-4-2000 |
光纤互连装置和无源光学部件的可靠度.第4部分:产品屏蔽 |
(Reliability of fibre optic interconnecting devices and passive optical components - Part 4 : product screening.) |
| NF C93-914-2000 |
光纤和光缆用机械接合和熔接保护器.第1部分:总规范 |
(Mechanical splices and fusion splice protectors for optical fibres and cables - Part 1 : generic specification.) |
| NF C93-915-1-2001 |
光纤循环器.总规范 |
(Fibre optic circulators - Generic specification.) |
| NF C93-916-1-2002 |
纤维光学空间开关.第1部分:一般规范 |
(Fibre optic spatial switches - Part 1 : generic specification.) |
| NF C93-918-2001 |
光纤波长开关.总规范 |
(Fibre optic wavelength switches - Generic specification.) |
| NF C94-110-1989 |
无线电发射设备的安全要求 |
(Safety requirements for radio transmitting equipment.) |
| NF C94-110/A1-1992 |
NF EN 60215-1989的修改1 |
() |
| NF C94-110/A2-1995 |
NF EN 60215-1989的修改2 |
() |
| NF C94-1101-1992 |
NF C94-110-89的修改件1.(欧洲标准EN 60215的修改件1) |
() |
| NF C94-1102-1995 |
NF C94-110 89年6月补充件2 |
() |
| NF C94-221-2000 |
无线电发射机的测量方法.第1部分:广播发射机的总特征 |
(Methods of measurement for radio transmitters - Part 1 : general characteristics for broadcast transmitters.) |
| NF C94-225-1994 |
无线电发射机的测量方法.第5部分:电视发射机的特性 |
(Methods of measurement for radio transmitters. Part 5 : performance characteristics of television transmitters.) |
| NF C94-228-1995 |
无线电发射机的测量方法.第8部分:检验电视发射机和换位器用的残留边带解调器的性能特征 |
(Methods of measurement for radio transmitters. Part 8 : performance characteristics of vestigial-sideband demodulators used for testing television transmitters and transposers.) |
| NF C94-229-1995 |
无线电发射机的测量方法.第9部分:电视换位器的特性 |
(Methods of measurement for radio transmitters. Part 9 : performance characteristics for television transposers.) |
| NF C94-230-1993 |
无线电发射机的测量方法.第10部分:采用插入测试信号法对电视发射机和转发机的测量 |
(Methods of measurement for radio transmitters. Part 10 : methods of measurement for television transmitters and transposers employing insertion test signals.) |
| NF C94-231-1993 |
无线电发射机的测量方法.第11部分:无线电差转机的测量方法 |
(Methods of measurement for radio transmitters. Part 11 : transposers for fm sound broadcasting.) |
| NF C94-232-1-1993 |
无线电发射机的测量方法.第12部分:音响设备和电视播放设备用发射机和换位器的草拟说明导则.第1节:规定特性 |
(Methods of measurement for radio transmitters. Part 12 : guideline for drawing up descriptive leaflets for transmitters and transposers for soud and television broadcasting. Characteristics to be specified.) |
| NF C94-232-2-1993 |
无线电发射机的测量方法.第12部分:音响设备和电视播放设备用发射机和换位器的草拟说明导则.第2节:说明卡 |
(Methods of measurement for radio transmitters. Part 12 : guidelines for drawing up descriptive leaflets for transmitters and transposers for sound and television broadcasting. Specification sheets.) |
| NF C94-233-1993 |
无线电发射机的测量方法.第13部分:调频广播的特性 |
(Methods of measurement for radio transmitters. Part 13 : performance characteristics for fm sound broadcasting.) |
| NF C94-234-1997 |
无线电发射机的测量方法.第14部分:使用同样的或临近天线的两个或更多的发射机产生的外部相互调制产物 |
(Methods of measurement for radio transmitters. Part 14 : external intermodulation products caused by two or more transmitters using the same or adjacent antennas.) |
| NF C94-235-2000 |
无线电发射机的测量方法.第15部分:声音广播用的调幅发射机 |
(Methods of measurement for radio transmitters - Part 15 : amplitude-modulated transmitters for sound broadcasting.) |
| NF C94-566-1998 |
射频电磁场暴露测量.频率范围100KHZ-1GHZ的场强 |
(Measurement of exposure to radio-frequency electromagnetic fields. Field strength in the frequency range 100 kHz to 1 GHz.) |
| NF C94-864-2-1998 |
广播传输或传输系统和管理设备之间互联标准,第2部分:用数据总线型互联界面标准 |
(Standardization of interconnections between broadcasting transmitters or transmitter systems and supervisory equipment. Part 2 : interface standards for systems using data bus type interconnections.) |
| NF C95-230-2002 |
阴极射线管的机械安全 |
(Mechanical safety of cathode ray tubes.) |
| NF C96-001-1984 |
电子件.半导体器件.分立件和集成电路.第1部分:总则 |
(Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 1 : general.) |
| NF C96-002-2001 |
半导体器件.分立器件和集成电路.第2部分:整流二极管 |
(Semiconductor devices - Discrete devices and integrated circuits - Part 2 : rectifier diodes.) |
| NF C96-003-1986 |
半导体器件.分立器件和集成电路.第3部分:信号(包括开关)和整流二极管 |
(Semiconductor devices. Discrete devices and integrated circuits. Part 3 : signal (including switching) and regulator diodes.) |
| NF C96-005-1-2001 |
半导体分立器件和集成电路.第5-1部分:光电器件.总则 |
(Discrete semiconductor devices and integrated circuits - Part 5-1 : optoelectronic devices - General.) |
| NF C96-005-1/A1-2002 |
分立式半导体器件和集成电路.第5-1部分:光电器件.通则 |
(Discrete semiconductor devices and integrated circuits - Part 5-1 : optoelectronic devices - General.) |
| NF C96-005-1/A2-2002 |
半导体分立器件和集成电路.第5-1部分:光电子器件.总则 |
(Discrete semiconductor devices and integrated circuits - Partie 5-1 : optoelectronic devices - General.) |
| NF C96-005-1994 |
分立器件和集成电路.第5部分:光电器件测量方法 |
(Discrete devices and integrated circuits. Part 5 : optoelectronic devices.) |
| NF C96-005-2-2001 |
分立半导体器件和集成电路.第5-2部分:光电器件.基本额定值和特性 |
(Discrete semiconductor devices and integrated circuits - Part 5-2 : optoelectronic devices - Essential ratings and characteristics.) |
| NF C96-005-2/A1-2003 |
半导体分立器件和集成电路.第5-2部分:光电子器件.基本额定值及特性 |
(Discrete semiconductor devices and integrated circuits - Partie 5-2 : optoelectronic devices - Essential ratings and characteristics.) |
| NF C96-005-3-2001 |
分立半导体器件和集成电路.第5-3部分:光电设备.测量方法 |
(Discrete semiconductor devices and integrated circuits - Part 5-3 : optoelectronic devices - Measuring methods.) |
| NF C96-005-3/A1-2002 |
半导体分立器件和集成电路.第5-3部分:光电子器件.测量方法 |
(Discrete semiconductor devices and integrated circuits - Partie 5-3 : optoelectronic devices - Measuring methods.) |
| NF C96-006-1984 |
电子器件.半导体器件.分立器件和集成电路.第6部分:可控硅件 |
(Electronic components. Semiconductor devices. Discrete devices and integrated circuits. Part 6 : thyristors.) |
| NF C96-007-1989 |
半导体器件.分立器件和集成电路.第7部分:二极管 |
(Semiconductor devices. Discrete devices and integrated circuits. Part 7 : bipolar transistors.) |
| NF C96-008-1985 |
半导体器件.分立器件和集成电路.第8部分:场效应晶体管 |
(Semiconductor devices. Discrete devices and integrated circuits. Part 8 : field-effect transistors.) |
| NF C96-012-2000 |
集成电路.存储器件插脚配置 |
(Integrated circuits - Memory devices pin configurations.) |
| NF C96-013-3-2000 |
半导体装置的机械标准化.第3部分:集成线路轮廓绘图准备的一般规则 |
(Mechnical standardization of semiconductor devices - Part 3 : general rules for the preparation of outline drawings of integrated circuits.) |
| NF C96-013-4-2000 |
半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式 |
(Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.) |
| NF C96-013-4/A1-2002 |
半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编码系统 |
(Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.) |
| NF C96-013-4/A2-2003 |
半导体器件的机械标准化.第4部分:半导体器件封装外形形状的分类和编码系统 |
(Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages.) |
| NF C96-013-6-1-2002 |
半导体器件的机械标准化.第6-1部分:平面式安装半导体器件外壳外形图绘制的一般规则.海鸥翼式铅终端的设计指 |
(Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lea) |
| NF C96-013-6-12-2002 |
半导体器件的机械标准化.第6-12部分:表面安装半导体器件封装外形图绘制的一般规则.矩形小节距栅极矩阵列的 |
(Mechanical standardization of semiconductor devices - Part 6-12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch g) |
| NF C96-013-6-2-2002 |
半导体器件的机械标准化.第6-2部分:绘制表面安装半导体器件封装外形图的一般规则.1.5mm、1.27mm和1.00mm 树 |
(Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27) |
| NF C96-013-6-3-2001 |
半导体装置的机械标准化.第6-3部分:半导体装置包装的表面安装的绘图制备的一般规则.四方块包装件包装尺寸的 |
(Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package d) |
| NF C96-013-6-4-2003 |
半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列(BGA)封装尺 |
(Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package) |
| NF C96-013-6-5-2002 |
半导体器件的机械标准化.第6-5部分:表面安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计 |
(Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ba) |
| NF C96-013-6-6-2002 |
半导体器件的机械标准化.第6-6部分:平面式安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设 |
(Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch la) |
| NF C96-013-6-8-2002 |
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.玻璃密封的陶瓷四边形扁平 |
(Mechanical standardization of semiconductor devices - Part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed) |
| NF C96-016-1-2003 |
半导体器件.第16-1部分:微波集成电路.放大器 |
(Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers.) |
| NF C96-016-3-2003 |
半导体器件.第16-3部分:微波集成电路.变频器 |
(Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters.) |
| NF C96-022-1-2003 |
半导体器件.机械和气候试验方法.第1部分:总则 |
(Semiconductor devices - Mechanical and climatic test methods - Part 1 : general.) |
| NF C96-022-10-2002 |
半导体器件.机械和气候试验方法.第10部分: 机械振动 |
(Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock.) |
| NF C96-022-11-2002 |
半导体器件.机械和气候试验方法.第11部分: 温度的急速变化.双液电镀槽法 |
(Semiconductor devices - Mechanical and climatic test methods - Part 11 : rapid change of temperature - Two-fluid-bath method.) |
| NF C96-022-12-2002 |
半导体器件.机械和气候试验方法.第12部分: 振动、可变频率 |
(Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency.) |
| NF C96-022-13-2002 |
半导体器件.机械和气候试验方法.第13部分: 盐性环境 |
(Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere.) |
| NF C96-022-15-2003 |
半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度 |
(Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices.) |
| NF C96-022-16-2003 |
半导体器件.机械和气候试验方法.第16部分:粒子碰撞噪声探测(PIND) |
(Semiconductor devices - Mechanical and climatic test methods - Part 16 : particle impact noise dectection (PIND).) |
| NF C96-022-17-2003 |
半导体器件.机械和气候试验方法.第17部分:中子辐照 |
(Semiconductor devices - Mechanical and climatic test methods - Part 17 : neutron irradiation.) |
| NF C96-022-18-2003 |
半导体器件.机械和气候试验方法.第18部分:电离辐射(总剂量) |
(Semiconductor devices - Mechanical and climatic test methods - Part 18 : ionizing radiation (total dose).) |
| NF C96-022-19-2003 |
半导体器件.机械和气候试验方法.第19部分:模剪切强度试验 |
(Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength.) |
| NF C96-022-2-2002 |
半导体器件.机械和气候试验方法.第2部分:低气压 |
(Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure.) |
| NF C96-022-20-2003 |
半导体器件.机械和气候试验方法.第20部分:塑料密封的SMDs抗湿气和钎焊热的综合影响 |
(Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat.) |
| NF C96-022-22-2003 |
半导体器件.机械和气候试验方法.第22部分:粘接强度 |
(Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength.) |
| NF C96-022-3-2002 |
半导体器件.机械和气候试验方法.第3部分:外观检验 |
(Semiconductor devices - Mechanical and climatic test methods - Part 3 : external visual examination.) |
| NF C96-022-31-2003 |
半导体器件.机械和气候试验方法.第31部分:塑料密封器件的易燃性(内部引起的) |
(Semiconductor devices - Mechanical and climatic test methods - Part 31 : flammability of plastic-encapsulated devices (internally induced).) |
| NF C96-022-36-2003 |
半导体器件.机械和气候试验方法.第36部分:稳态加速 |
(Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state.) |
| NF C96-022-4-2002 |
半导体器件.机械和气候试验方法.第4部分:湿热、稳态、高加速应力试验 |
(Semiconductor devices - Mechanical and climatic test methods - Part 4 : damp heat, steady state, highly accelerated stress test (HAST).) |
| NF C96-022-5-2003 |
半导体器件.机械和气候试验方法.第5部分:稳态温度湿度偏差耐久性试验 |
(Semiconductor devices - Mechanical and climatic test methods - Part 5 : steady-state temperature humidity bias life test.) |
| NF C96-022-6-2002 |
半导体器件.机械和气候试验方法.第6部分:高温下储存 |
(Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature.) |
| NF C96-022-7-2002 |
半导体器件.机械和气候试验方法.第7部分:其他残余气体的分析和内部水分含量的测量 |
(Semiconductor devices - Mechanical and climatic test methods - Part 7 : internal moisture content measurement and the analysis of other residual gases.) |
| NF C96-022-9-2002 |
半导体器件.机械和气候试验方法.第9部分:标记的永久性 |
(Semiconductor devices - Mechanical and climatic test methods - Part 9 : permamence of marking.) |
| NF C96-031-1-1990 |
IEC 821 VME 总线.第1部分:1～4字节数据微处理机系统总线 |
(IEC bus 821 VME. Microprocessor system bus for 1 to 4 byte data. Part 1.) |
| NF C96-031-2-1990 |
IEC 821 VME 总线.第2部分:1～4字节数据微处理机系统总线 |
(IEC bus 821 VME. Microprocessor system bus for 1 to 4 byte data. Part 2.) |
| NF C96-032-1992 |
IEC 822 VSB.IEC 821 VME总线的平行子系统总线 |
(IEC 822 VSB. Parallel sub-system bus of the IEC 821 VMEBUS.) |
| NF C96-033-1992 |
有关微处理机的术语 |
(Terminology related to microprocessors.) |
| NF C96-036-1992 |
微处理机系统用二进制浮点运算法 |
(Binary floating-point arithmetic for microprocessor systems.) |
| NF C96-037-2000 |
集成电路.生产线验收应用指南 |
(Integrated circuits - Manufacturing line approval application guideline.) |
| NF C96-045-1992 |
半导体器件.集成电路.第11部分:半导体集成电路(混合电路除外)的分规范 |
(Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits.) |
| NF C96-1111-1980 |
NF C96-111-80的补充件1 |
() |
| NF C96-1121-1981 |
NF C96-112-80的补充件1 |
() |
| NF C96-200-1983 |
微型结构.逻辑微型结构.一般规定 |
(Microcircuits. Digital microcircuits. General requirements.) |
| NF C96-251-1983 |
微型结构.逻辑微型结构.编程序存储器 |
(MICROCIRCUITS. DIGITAL MICROCIRCUITS. FUSIBLE LINK PROM MEMORIES.) |
| NF C96-260-1-2002 |
集成电路.150kHz-1GHz电磁辐射的测量.第1部分:一般条件和定义 |
(Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1 : general conditions and definitions.) |
| NF C96-260-4-2002 |
集成电路.150kHz-1GHz电磁辐射的测量.第4部分:传导辐射的测量.1 ohm/150 ohm直接耦合法 |
(Integrated circuits - Measurement of Electromagnetic Emissions, 150 kHz - 1 GHz - Part 4 : measurement of conducted emission - 1 ohm/150 ohm direct coupling method.) |
| NF C96-260-5-2003 |
集成电路.150kHz-1GHz电磁辐射的测量.第5部分:工作台法拉第筒法测量感应辐射 |
(Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Partie 5 : measurement of conducted emissions, Workbench faraday cage method.) |
| NF C96-260-6-2003 |
集成电路.150kHz-1GHz电磁辐射的测量.第6部分:传导辐射测量.磁探测器法 |
(Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 6 : measurement of conducted emissions - Magnetic probe method.) |
| NF C96-315-1987 |
微型结构.超高频微电子学.超高频微电子学及其同样规定的有关装置.衰减器和负载 |
(MICROWAVE MICROELECTRONICS. ATTENUATORS AND LOADS.) |
| NF C96-316-1988 |
微波装置.环行器.绝缘子 |
(MICROWAVE DEVICES. CIRCULATORS. ISOLATORS.) |
| NF C96-317-1988 |
微波装置.同轴和波导继电器和开关 |
(MICROWAVE DEVICES. ELECTROMECHANICAL COAXIAL AND IN WAVEGUIDES RELAYS AND SWITCHES.) |
| NF C96-318-1991 |
超高频装置.有源延迟线 |
(MICROWAVE DEVICES. ACTIVE DELAY LINES.) |
| NF C96-411-1984 |
混合微型结构.薄膜电阻集成电路（ＣＩＲ）.一般规定 |
(Hybrid microcircuits. Film deposit resistive integrated circuits. General requirements.) |
| NF C96-627-1-3-2000 |
波导型电介谐振器.第1-3部分:一般信息和试验条件.在微波频率内电介谐振器材料的复合相关可允许性的测量方法 |
(Waveguide type dielectric resonators - Part 1-3 : general information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequenc) |
| NF C96-628-1-2000 |
频率控制和选则用表面安装的压电器件.标准外形和终端引线的连接.第1部分:塑料模压外壳外形 |
(Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1 : plastic moulded enclosure outlines.) |
| NF C96-832-1981 |
半导体.超高频二极管.肖特基二极管.一般规定 |
(SEMICONDUCTORS. MICROWAVE DIODES. SCHOTTKY DIODES. GENERAL REQUIREMENTS.) |
| NF C97-001-1-2000 |
数字音频接口.第1部分:总则 |
(Digital audio interface - Part 1 : general.) |
| NF C97-001-3-2000 |
数字音频接口.第3部分:消费者应用 |
(Digital audio interface - Part 3 : consumer applications.) |
| NF C97-001-4-2000 |
数字音频接口.第4部分:专业应用 |
(Digital audio interface - Part 4 : professional applications.) |
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